Tungsten Copper Alloy Cubes used for Heat sink
Tungsten copper alloy is used extensively in thermal mounting plates, heat bases, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.
The thermal conductivity and thermal expansion characteristics of the semiconductor and the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation. The sketch shows the principle structure of a hermetically sealed electronic package.
Applicatioins of Tungsten Copper Alloy:
Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
Advantages of Copper Tungsten Heat sink:
Strong hardness(86~93.5HRA)
High arc resistance combined with good electrical conductivity
High thermal conductivity
Low thermal expansion.
Specifications of WCu Alloys:
| Material | W90Cu10 | W88Cu12 | W85Cu15 | W80Cu20 | W75Cu25 |
| Tungsten Content (wt%) | 90 ± 1 | 88 ± 1 | 85 ± 1 | 80 ± 1 | 75 ± 1 |
| Density at 20°C (g/cm3) | 17.0 | 16.8 | 16.3 | 15.6 | 14.9 |
| Coefficient of thermal expansion at 20°C (10-6/K) | 6.5 | 6.7 | 7.0 | 8.3 | 9.0 |
| Code No. | Chemical Composition % | Mechanical properties |
| CU | Impurity | W | Density (g/cm3) | Hardness HB | RES(cm) | Conductivity IACS/ % | TRS/ Mpa |
| CuW(50) | 50+2.0 | 0.5 | Balance | 11.85 | 115 | 3.2 | 54 | |
| CuW(55) | 45+ 2.0 | 0.5 | Balance | 12.30 | 125 | 3.5 | 49 | |
| CuW(60) | 40+2.0 | 0.5 | Balance | 12.75 | 140 | 3.7 | 47 | |
| CuW(65) | 35+2.0 | 0.5 | Balance | 13.30 | 155 | 3.9 | 44 | |
| CuW(70) | 30+2.0 | 0.5 | Balance | 13.80 | 175 | 4.1 | 42 | 790 |
| CuW(75) | 25+2.0 | 0.5 | Balance | 14.50 | 195 | 4.5 | 38 | 885 |
| CuW(80) | 20+2.0 | 0.5 | Balance | 15.15 | 220 | 5.0 | 34 | 980 |
| CuW(85) | 15+2.0 | 0.5 | Balance | 15.90 | 240 | 5.7 | 30 | 1080 |
| CuW(90) | 10+2.0 | 0.5 | Balance | 16.75 | 260 | 6.5 | 27 | 1160 |
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86HRA Tungsten Copper Alloy Cubes Arc Resistance For Heat Sink Images
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